Following the well-known suspension of its in-house Kirin chipset development due to the enduring US trade sanctions, Huawei faced a pause in its chipset progress, culminating in the Kirin 9000 being the final offering introduced in 2020.
However, a recent report from Weibo’s Fixed Focus Digital hints at a potential revival in Huawei’s chipset endeavors. The rumor suggests that Huawei is in the early stages of crafting its latest Kirin chipset, with an intriguing twist: a dual-stacked design comprising two 14nm chips.
This tantalizing leak, originating on Twitter, hints that this enigmatic Kirin chip is slated for production on the 7nm node by SMIC. Allegedly, Huawei has unlocked a technique to stack two 14nm chips atop each other, a process intended to yield performance comparable to the 7nm standard, all while maintaining a remarkably low power consumption of just 7W. However, the validity of this concept still stands unconfirmed, awaiting further substantiation.
Delving deeper, another rumor brings to light the potential configurations for the forthcoming Kirin chip. The first configuration is rumored to incorporate two CPU Cortex-X3 cores, accompanied by two CPU Cortex-A715 cores and a quartet of Cortex-A510 cores. These computational components would be complemented by the Arm Immortalis-G715 MC16 GPU. Conversely, the alternative configuration seeks to integrate 2 CPU Cortex-X1 cores, 3 Cortex-A78 cores, 3 Cortex-A55 cores, and the Arm Mali G710 MC10/6 GPU.
In an additional intriguing tidbit, another Weibo post points towards a trio of fresh Kirin chipsets in the pipeline—namely, the Kirin 720, Kirin 830, and Kirin 9100. The Kirin 9100, in particular, has been the subject of buzz as a potential powerhouse for the forthcoming Huawei P70 model.
As the anticipation builds, the Huawei community eagerly awaits an official statement from the company to validate these emerging reports and provide further insight into the possible renaissance of the Kirin chipset series.
