MediaTek has quietly introduced its latest processor, Dimensity 7050. MediaTek Dimensity 7050 is making its debut on the upcoming realme 11, with the realme 11 Pro+ model recently seen on Geekbench with Dimensity 7050 and 12GB of RAM.
MediaTek is actually rebranding its existing Dimensity 700, 800, and 900 series SoCs under the new Dimensity 6000 and 7000 series, as quoted from Gizmo China. This move is intended to simplify the company’s product portfolio and provide a more transparent naming system for consumers. The technology and core specifications mostly remain the same. MediaTek Dimensity 7050 is a new version of Dimensity 1080.
MediaTek Dimensity 7050 Specifications
The Dimensity 7050 SoC has been produced using advanced 6nm process technology from TSMC, and its CPU consists of two high-performance 2.6GHz Cortex-A78 cores and six power-efficient 2.0GHz Cortex-A55 cores. The GPU features Mali-G68 MC4 with support for LPDDR5/4x memory and UFS 3.1/2.1 storage standards.
In terms of display capabilities, this chipset can handle screens with resolutions up to 2520 x 1080 pixels and a 120Hz refresh rate. Camera support is also impressive, with the ability to accommodate lenses up to 200MP, 4K HDR video recording, and advanced features such as hardware HDR video, triple HDR-ISP, and MENR.
On the video front, the Dimensity 7050 offers encoding support for HEVC and H.264 formats, as well as playback compatibility with HEVC, H.264, MPEG-1/2/4, and VP-9 codecs.
Devices powered by the Dimensity 7050 chipset are expected to provide a substantial boost to gaming performance. MediaTek has integrated features such as Wi-Fi Rapid Channel, a customized 5G HSR mode for gaming, and super energy-saving hotspot technology to ensure a smooth gaming experience for users.
In addition, this processor comes with support for global navigation satellite systems (GNSS) and the latest Wi-Fi 6 standard, which further expands its capabilities and compatibility.
