MediaTek has quietly released a new mid-range chipset, the Dimensity 7050. The upcoming Realme 11 Pro Series, which will be launched on May 10, 2023, will be the first phone to use this SoC.
According to Gizmochina, the MediaTek Dimensity 7050 is a rebranding of the Dimensity 1080. So, most of the specifications and technology used are the same.
Made with 6nm fabrication by TSMC, the Dimensity 7050 has a configuration of two Cortex-A78 2.6Ghz and six Cortex-155 2.0GHz. The GPU used is the Mali G68 MC4, with support for LPDDR5/4x RAM and UFS 3.1/2.1 storage.
The maximum supported screen resolution is 2520 x 1080 pixels with a refresh rate of 120Hz. For the camera, it can support up to 200MP, with 4K HDR video recording capabilities and various features such as HDR, triple HDR-ISP, and MENR. For connectivity, it already supports dual-sim 5G, Wi-Fi 6, and Bluetooth 5.2.
The MediaTek Dimensity 7050 is known to first appear in the Realme 11 Pro Series, which will be released soon. The Realme 11 Pro+ model recently appeared on the Geekbench database, carrying the Dimensity 7050 chipset and 12GB of RAM.
From the Geekbench benchmark results, the Dimensity 7050 on the Realme 11 Pro+ recorded a total score of 838 for single-core and 2,302 for multi-core. However, for its actual performance, we’ll have to wait until after the launch of the Realme 11 Pro Series.
