Xiaomi has announced the completion of its first 3nm smartphone system-on-chip (SoC), representing a significant breakthrough in China’s high-performance semiconductor space. This new SoC is expected to provide substantial improvements in both efficiency and processing power, making it well-suited for demanding tasks like AI processing, gaming, and multitasking. The transition to a 3nm process aligns Xiaomi’s chip technology with global leaders in mobile processors, reflecting China’s increasing independence in advanced semiconductor production.
The 3nm chipset is designed with ARM’s latest Cortex-X925 CPU and Immortalis-G925 GPU, which aim to boost performance and enable advanced features in future Xiaomi flagship devices. Given that 3nm chip manufacturing typically relies on extreme ultraviolet (EUV) lithography, Xiaomi’s successful tape-out is particularly notable, showcasing their ability to work around these technological limitations. Industry experts believe that this SoC could enhance battery life and support next-gen AI and imaging features, likely boosting Xiaomi’s appeal to performance-focused consumers.
Expected to debut in 2024 flagship smartphones, Xiaomi’s chip should position the brand to compete with industry leaders like Apple, Qualcomm, and MediaTek, which are also incorporating 3nm technology into their upcoming releases. Though Xiaomi’s SoC does not yet integrate an in-house 5G modem, the company’s progress in custom chip development reflects broader ambitions to reduce dependence on third-party suppliers.
This move is also part of a larger trend in China’s tech sector, where companies are increasingly focusing on domestic research and development in response to ongoing international trade restrictions. Xiaomi’s achievement may inspire further advancements in China’s semiconductor capabilities, signaling more high-performance, locally produced tech solutions in the near future.
